Profile control platen
AssigneeApplied Materials, Inc.
InventorsHung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
Life of this patent
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Abstract
A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.
Claims17
A chemical mechanical polishing apparatus comprising:
- a platen including:
- a surface upon which a polishing pad can be placed, the surface having a first region and a second region, the surface being operable to exert force against the polishing pad during polishing, the surface being a substantially flat, circular surface;
- a pressurizable chamber located beneath the second region, the chamber being operable to cause the second region to bow outwardly when the chamber is pressurized;
- and
- a controller operable to adjust the amount of pressure in the chamber;
- wherein the first region remains substantially flat when the pressurizable chamber is pressurized.
A chemical mechanical polishing apparatus comprising:
- a platen including:
- a surface upon which a polishing pad can be placed, the surface being operable to exert force against the polishing pad during polishing, the surface having an outer radial region, a center radial region, the center radial region being coplanar with the outer radial region at all times, the surface further having a middle radial region that lies in between the outer radial region and the center radial region;
- a pressurizable chamber located beneath the middle radial region, the chamber being operable to cause the middle radial region to bow outwardly when the chamber is pressurized;
- and
- a controller operable to adjust the amount of pressure in the chamber.
Dependencies are inferred from the claim text.