Method and apparatus for polishing a substrate
AssigneeAsahi Glass Company, Limited
InventorsItsuro Watanabe, Takashi Kubo
Life of this patent
Estimating the term…
Abstract
The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.
Claims8
A method for polishing a substrate comprising:
- attaching a substrate to a stretched film on a frame, wherein the attaching of the substrate to the stretched film on the frame is done either with the frame already installed on a carrier or by installing the frame holding the stretched film and attached substrate on the carrier;
- bringing the frame and a polishing surface-plate closer relative to each other and polishing a surface of the substrate attached to the stretched film by pressing the surface of the substrate to the polishing surface-plate;
- and
- removing the substrate from the stretched film on the frame after completing the polishing of the surface of the substrate, wherein said step of removing of the substrate after the completion of the polishing of the surface of the substrate is further performed either prior to or after removing the frame from the carrier.
A device for polishing a substrate comprising:
- a substrate attaching stage configured to attach a substrate to a frame by attachment to a film stretched on the frame;
- a frame installing stage configured to install the frame on a carrier;
- a polishing stage configured to polish the substrate by bringing the carrier and a polishing surface-plate closer relative to each other after the installation of the frame on the carrier and pressing a surface to be polished of the substrate attached to the frame to the polishing surface-plate;
- a frame removing stage configured to remove the frame from the carrier, and
- a substrate removing stage configured to remove the polished substrate from the frame.
Dependencies are inferred from the claim text.