Compliant interconnect assembly

A compliant interconnect assembly comprising:

• a first circuit member;
• a second circuit member;
• a first dielectric layer having a first major surface and a plurality of through openings;
• a plurality of electrical traces positioned against the first major surface of the first dielectric layer, the electric traces comprising a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer, the first distal ends adapted to electrically couple with the first circuit member;
• and
• a second dielectric layer having a first major surface positioned against at least one of the electric traces and the first major surface of the first dielectric layer, the second dielectric layer having a plurality of through openings through which the electric traces electrically couple with the second circuit member;
• and
• at least one additional circuitry plane positioned against at least one of the major surfaces of the second dielectric layer, the additional circuitry plane comprising a plurality of through openings at least a portion of which are aligned with a through opening in the second dielectric layer.

A method of making a compliant interconnect assembly, the method comprising the steps of:

• positioning a plurality of electrical traces against the first major surface of a first dielectric layer, the electric traces comprising a plurality of conductive compliant members having first distal ends aligned with a plurality of through openings in the first dielectric layer;
• positioning a first major surface of a second dielectric layer against the electric traces and the first major surface of the first dielectric layer, the second dielectric layer having a plurality of through openings;
• electrically coupling the first distal ends to a first circuit member;
• and
• electrically coupling a second circuit member to a second circuit member through the openings in the second dielectric layer;
• and
• locating an additional circuitry plane along at least one major surface of the second dielectric layer, the additional circuitry plane comprising a plurality of through openings at least a portion of which are aligned with a through opening in the second dielectric layer.

A compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member, the compliant interconnect assembly comprising:

• a first dielectric layer having a first major surface and a plurality of through openings;
• a plurality of electrical traces positioned against the first major surface of the first dielectric layer, the electric traces comprising a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer, the first distal ends adapted to electrically couple with the first circuit member;
• a second dielectric layer having a first major surface positioned against the electric traces and the first major surface of the first dielectric layer, the second dielectric layer having a plurality of through openings through which the electric traces electrically couple with the second circuit member;
• and
• at least one additional circuitry plane positioned against at least one of the major surfaces of the first dielectric layer, the additional circuitry plane comprising a plurality of through openings at least a portion of which are aligned with a through opening in the first dielectric layer.