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US 7,114,959 B2Granted
Land grid array with socket plate
AssigneeIntel Corporation
InventorsBrent S. Stone, Joel A. Auernheimer
Life of this patent
Estimating the term…
Abstract
A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plate. Impedance discontinuity seen by signals passing through the socket may be reduced.
Claims35
A method comprising:
- providing capacitance between contacts on a land grid array package and a ground plate in a socket;
- providing a contact, having two ends, in the socket, said contact having, on one end, a land and on the other end a spring contact;
- providing an electrical connection to ground on a printed circuit board via solder balls that contact the printed circuit board and the land of the contact;
- and
- providing additional socket contacts which extend through a conductive plate and over the conductive plate, said additional contacts arranged so that when the package is compressed against the socket the additional contacts make electrical contact to said plate.
2 more elements
A socket comprising:
- a socket base;
- a conductive plate over said base;
- a plurality of socket pins extending through said plate to contact an integrated circuit package on one end and to make electrical connection to a printed circuit board on the opposite end;
- and
- wherein said pins include a spring arm portion that bends down and contacts said plate.
2 more elements
An electronic device comprising:
- a land grid array package;
- a printed circuit board;
- a socket coupling said package to said printed circuit board, said socket including a socket base, a conductive plate over said base and under said package, and a plurality of socket pins extending through said plate to contact said integrated circuit package on one end and to make electrical connection to said printed circuit board on the opposite end;
- and
- additional contacts that are floating and that have ends that make an electrical connection to said plate.
2 more elements
A method comprising:
- providing capacitance between contacts on a land grid array package and a ground plate in a socket;
- providing a contact, having two ends, in the socket, said contact having, on one end, a land and onto other end a spring contact;
- providing an electrical connection to ground on a printed circuit board via solder balls that contact the printed circuit board and the land of the contact;
- and
- providing additional contacts with land ends connectable by solder balls to the package, said additional contacts being permanently fixed on one end to said plate and connectable on the other end through said lands to the printed circuit board.
2 more elements
A method comprising:
- providing capacitance between contacts on a land grid array package and a ground plate in a socket;
- providing a contact, having two ends, in the socket, said contact having, on one end, a land and on the other end a spring contact;
- providing an electrical connection to ground on a printed circuit board via solder balls that contact the printed circuit board and the land of the contact;
- and
- providing additional contacts which are floating and which have ends that, when deformed by the package, make an electrical connection to said plate.
2 more elements
A socket comprising:
- a socket base;
- a conductive plate over said base;
- a plurality of socket pins extending through said plate to contact an integrated circuit package on one end and to make electrical connection to a printed circuit board on the opposite end;
- and
- additional contacts that are floating and that have ends that, when deformed by a package, make an electrical connection to said plate.
2 more elements
An electronic device comprising:
- a land grid array package;
- a printed circuit board;
- a socket coupling said package to said printed circuit board, said socket including a socket base, a conductive plate over said base and under said package, and a plurality of socket pins extending through said plate to contact said integrated circuit package on one end and to make electrical connection to said printed circuit board on the opposite end;
- and
- wherein said pins include spring arm portions that bend down and contact said plate.
2 more elements
Dependencies are inferred from the claim text.