Apparatuses and method for transferring and/or pre-processing microelectronic workpieces

An apparatus for processing microelectronic workpieces, comprising:

• at least one process station configured to carry a microelectronic workpiece during processing;
• a pre-process station configured to identify and/or align the microelectronic workpiece, the pre-process station including a first workpiece support positioned to carry a microelectronic workpiece;
• and
• a storage station having a plurality of second workpiece supports, with each second workpiece support being positioned to carry a microelectronic workpiece before processing, after processing or both before and after processing, wherein the first and second workpiece supports are positioned to support coaxially located microelectronic workpieces.

An apparatus for handling microelectronic workpieces, comprising:

• at least one process station configured to carry a microelectronic workpiece during processing;
• a pre-process station configured to identify and/or align microelectronic workpieces at a first workpiece location with the microelectronic workpieces in a first workpiece plane;
• and
• a storage station having a plurality of workpiece supports, each positioned to carry a microelectronic workpiece in a corresponding second workpiece location with the microelectronic workpiece in a second workpiece plane before processing, after processing or both before and after processing the microelectronic workpiece, wherein the first and second workpiece locations are coaxial along an axis generally normal to at least one of the workpiece planes.

An apparatus for handling microelectronic workpieces, comprising:

• at least one process station configured to carry a microelectronic workpiece during processing;
• a pre-process station configured to identify and/or align microelectronic workpieces, the pre-process station having a first footprint;
• and
• a storage station having a plurality of workpiece supports, with each workpiece support being positioned to carry a microelectronic workpiece before processing, after processing or both before and after processing the microelectronic workpiece, the storage station having a second footprint, wherein at least a portion of at least one of the first and second footprints overlaps at least a portion of the other of the first and second footprints and wherein the workpiece supports are first workpiece supports positioned to carry first microelectronic workpieces centered on an axis, further wherein the pre-process station includes a second workpiece support configured to carry a second microelectronic workpiece centered on the same axis.

An apparatus for handling microelectronic workpieces, comprising:

• at least one process station configured to carry a microelectronic workpiece during processing;
• a pre-process station configured to identify and/or align microelectronic workpieces, the pre-process station having a first footprint;
• and
• a storage station having a plurality of workpiece supports, with each workpiece support being positioned to carry a microelectronic workpiece before processing, after processing or both before and after processing the microelectronic workpiece, the storage station having a second footprint, wherein at least a portion of at least one of the first and second footprints overlaps at least a portion of the other of the first and second footprints, and wherein the workpiece supports are first workpiece supports positioned to carry first microelectronic workpieces centered on an axis, further wherein the pre-process station includes a second workpiece support configured to carry a second microelectronic workpiece centered on the same axis.

An apparatus for handling microelectronic workpieces, comprising:

• an input/output station configured to removably receive microelectronic workpieces at an input/output location;
• a storage station spaced apart from the input/output location and configured to carry a plurality of microelectronic workpieces, the storage station including a plurality of first workpiece supports positioned to carry a plurality of microelectronic workpieces;
• at least one process station spaced apart from the storage station and the input/output station;
• a pre-process station configured to identify and/or align a microelectronic workpiece, the pre-process station further having a second workpiece support, and wherein the first and second workpiece supports are positioned to carry microelectronic workpieces coaxially;
• a first transfer device movably positioned proximate to the input/output station, the first transfer device being configured to move the microelectronic workpieces directly between the input/output location and the storage station;
• and
• a second transfer device movably positioned proximate to the at least one process station, the second transfer device being configured to move the microelectronic workpieces directly between the storage station and the at least one process station.