Pattern formation method and substrate manufacturing apparatus

A pattern formation method for discharging a prescribed fluid onto a substrate from an ink-jet head forming an arbitrary pattern, said pattern formation method comprising:

• a first step of disposing a plurality of first droplets of the fluid at certain intervals on a pattern-forming region of the substrate;
• a second step of disposing a plurality of second droplets of the fluid on the pattern-forming region of the substrate, the second step being performed while the first droplets have a surface tension that prevents the first and second droplets from intermixing so that second droplets overlapping the first droplets slide along the first droplets and situate within the intervals between the first droplets;
• wherein the arbitrary pattern is formed at least by the first and second steps;
• the prescribed fluid for forming patterns on the substrate includes a material for industrial use;
• and
• the fluid for the first and second droplets is the same material.