Burn-in oven heat exchanger having improved thermal conduction
AssigneeMicro Control Company
InventorsHarold E. Hamilton, Tom A. Tremmel
Life of this patent
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Abstract
A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.
Claims29
A heat exchange system for controlling the temperature of an integrated circuit chip during burn-in temperature stressing of the chip, the system comprising:
- a chip mount configured to support a chip;
- a liquid source;
- a heat sink having a bore and a surface facing the chip mount and including a port fluidically coupled to the liquid source;
- and
- a chip temperature sensor mounted in the bore and positioned to engage a chip supported in the chip mount, the chip temperature sensor having a chip temperature output signal that is indicative of a temperature of the chip.
A heat exchange system for integrated circuit chip burn-in temperature stressing, the system comprising:
- a chip mount configured to support a chip;
- a liquid source;
- a heat sink having a surface facing the chip mount, the surface facing the chip mount having a plurality of ports each fluidically coupled to the liquid source;
- a chip temperature sensor having a chip temperature output signal that is indicative of a temperature of a chip supported in the chip mount;
- and
- a liquid flow controller, controlling a liquid flow traveling from the liquid source through the ports.
A heat exchange system for controlling the temperature of an integrated circuit chip during burn-in temperature stressing of the chip, the system comprising:
- a chip mount configured to support a chip;
- a liquid source;
- a heat sink having a surface facing the chip mount and including a port fluidically coupled to the liquid source;
- a heat sink temperature sensor having a heat sink temperature output signal that is indicative of a temperature of the heat sink;
- a chip temperature sensor having a chip temperature output signal that is indicative of a temperature of a chip supported in the chip mount;
- and
- a liquid controller controlling a liquid flow traveling from the liquid source an through the port in response to the heat sink and chip temperature output signals.
Dependencies are inferred from the claim text.