Liquid cooling module
AssigneeHitachi, Ltd.
InventorsShinji Matsushita, Hironori Oikawa
Life of this patent
Estimating the term…
Abstract
A cooling module designed so that the following components are stacked above a CPU: a cooling jacket allowing a cooling liquid to absorb heat generated by the CPU, a pump causing the cooling liquid to circulate, a reserve tank used to provide a supplementary cooling liquid and to bleed air from the cooling liquid, and a first radiator that cools the cooling liquid, the cooling module being also designed so that a second radiator is located at a side of the first radiator to cool the cooling liquid, wherein the cooling liquid is driven by the pump so as to circulate from the cooling jacket, which absorbs heat generated by the CPU, through the radiators to the reserve tank.
Claims5
A cooling module for a CPU mounted in an information processing apparatus, the module comprising:
- a cooling jacket thermally connected to the CPU to transmit heat generated by the CPU to a cooling liquid;
- a pump that circulates the cooling liquid;
- a reserve tank used to provide a supplementary cooling liquid;
- and
- a first radiator and a second radiator which cause the cooling liquid to radiate heat,
- wherein the cooling jacket, the pump, the reserve tank, the first and second radiators are arranged in a circulating path for the cooling liquid,
- the pump and the reserve tank are installed above the cooling jacket, and the first radiator is installed above the pump and reserve tank, and
- the second radiator is located at a side of the cooling jacket, pump, reserve tank, and first radiator.
Dependencies are inferred from the claim text.