Method of producing of circuit board; for semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorNaohiro Mashino
Life of this patent
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Abstract
A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.
Claims7
A method of production of a circuit board, including:
- forming a plurality of holes in a first surface of a substrate;
- forming a plating power supply layer on the first surface, a second surface and sides of the substrate, and inner surfaces of the holes by electroless plating;
- forming a metal layer formed on the first surface, the second surface and sides of the substrate and burying the holes, by electroplating through the plating power supply layer;
- and
- polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.
Dependencies are inferred from the claim text.