Method of making components with releasable leads
AssigneeTessera, Inc.
InventorsBelgacem Haba, Konstantine Karavakis
Life of this patent
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Abstract
A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
Claims11
A method of making microelectronic connection components comprising the steps of:
- (a) providing a support structure including a dielectric layer defining an edge and one or more leads, the leads having anchor regions extending along the dielectric layer and having elongated sections extending beyond the edge;
- and
- (b) depositing a dielectric material on said leads electrophoretically so that the deposited dielectric material surrounds at least one of said elongated sections of said leads over at least a portion of the length of such section.
A method of making microelectronic connection components comprising the steps of:
- (a) providing a support structure and one or more leads, each said lead having a first end on said support structure, a second end and an elongated section extending along the support structure from the first end of the lead toward the second end of the lead;
- and
- (b) depositing a dielectric material on said leads electrophoretically so that the deposited dielectric material surrounds at least one of said elongated sections over a portion of its length without depositing the dielectric material on the first ends of the leads.
Dependencies are inferred from the claim text.