US 7,114,249 B2 · Substrate inspecting method and substrate inspecting apparatus using the method

Abstract

Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.

Claims15

Dependent claims

A substrate inspecting method to be executed between a first component mounting step of mounting a predetermined type of component on a substrate and a second component mounting step of mounting another component on a mounting area of the substrate on which no component is mounted in the first component mounting step, the method comprising:

inspecting the substrate that has undergone the first component mounting step, to determine whether or not the component mounted in the first component mounting step is improperly positioned so as to at least cover the mounting area for the another component to be mounted in the second component mounting step.

A substrate inspecting method for inspecting a component previously mounted on a substrate, the method comprising:

a) inspecting the component previously mounted on the substrate by fly inspection, to determine whether or not the component mounted is improperly mounted so as to at least partly cover a mounting area for a component to be mounted at a later point in time,
b) if it is determined by the step a) that the component is improperly mounted, outputting an error signal to signify that the component needs to be removed and remounted.

A substrate inspecting method, comprising:

a) setting an inspecting condition for substrates as either:
1) detecting a component that is missing in a mounting process of the substrates;
2) replacement date of an attracting nozzle used in the mounting process of the substrates is approaching;
or 3) all of the substrates are to be inspected;
b) read out substrate inspection data and store in a memory;
c) if inspecting condition 2) is set, confirm that the attracting nozzle replacement date is approaching;
d) image a substrate;
e) if inspecting condition 3) is set, perform both mounted component inspection and component fly inspection on the substrate, and output an inspection result;
f) if inspecting condition 3) is not set and if inspecting condition 2) is not set, which corresponds to inspecting condition 1) being set, perform only mounted component inspection on the substrate, determine if a missing component is detected, and if a missing component is detected, perform component fly inspection and output an inspection result based on both the mounted component inspection and the component fly inspection, and if a missing component is not detected, output an inspection result based only on the mounted component inspection;
and
g) if inspecting condition 3) is not set and if inspecting condition 2) is set, perform both mounted component inspection and component fly inspection on the substrate, and output an inspection result.

8 more elements

Dependencies are inferred from the claim text.

Substrate inspecting method and substrate inspecting apparatus using the method

Life of this patent

Substrate inspecting method and substrate inspecting apparatus using the method

Life of this patent

Abstract

Claims15