Component holding head, component mounting apparatus using same, and component mounting method

An electronic component mounting apparatus for mounting an electronic component onto a substrate, comprising:

• an electronic component feeding unit, which feeds an electronic component;
• an electronic component holding head, which holds the electronic component to be mounted onto a substrate;
• an imaging unit, which forms an image of a positioning mark formed at a terminal part of the electronic component held by said electronic component holding head, for correcting a position offset between the electronic component and the substrate to which the electronic component is to be mounted;
• a position offset detection unit, which detects a position offset of the electronic component relative to the substrate, based on image data of the positioning mark obtained by said imaging unit;
• a position correction unit which, based on the position offset detected by said position offset detection unit, performs control so as to correct the X direction and the Y direction position offset of the electronic component relative to the substrate, so that the electronic component with the thus corrected position offset is mounted to the substrate, wherein
• said electronic component holding head includes:
• a main electronic component holding unit;
• vacuum chuck provided on said main electronic component holding unit so as to face the surface of the electronic component to be held by vacuum chucking holes of said vacuun chucking, so that the electronic component is held by vacuum chucking holes to said main electronic component holding unit;
• and
• a light path part provided in the main electronic component holding unit, the light path part being configured to guide light shined onto the positioning mark formed at a terminal part of the electronic component to correct a position offset between the electronic component and the substrate to which the electronic component is to be mounted, wherein
• said vacuum chuck hold the electronic component at a position which is on straight lines substantially parallel to more than two edges of the electronic component respectively and substantially perpendicular to the positioning mark of the electronic component, said vacuum chucking holes partially covering the electronic component, said vacuum chucking holes being located in a vicinity of the positioning mark and avoiding the positioning mark so as to hold substantially all portions of the electronic component in engagement with said main electronic equipment holding unit.

A method of mounting an electronic component to a substrate, comprising:

• feeding an electronic component;
• forming an image of a positioning mark for compensation of a position offset between the electronic component and the substrate to which the electronic component is to be mounted;
• detecting a position offset of the electronic component relative to the substrate, based on the image data of the positioning mark;
• correcting the X direction and Y direction position offset of the electronic component relative to the substrate, based on the detected position offset;
• and
• holding a position offset corrected electronic component by said electronic component holding head and mounting the electronic component to the substrate, wherein
• said electronic component holding head includes:
• a main electronic component holding unit;
• said main electronic component holding unit having a vacuum chuck provided on said main electronic component holding unit so as to face the surface of the electronic component to be held by vacuum chucking holes of said vacuun chucking, so that the electronic component is held by vacuum chucking holes to said main electronic component holding unit;
• and
• a light path part provided in the main electronic component holding unit, the light path part being configured to guide light shined onto the positioning mark formed at a terminal part of the electronic component to correct a position offset between the electronic component and the substrate to which the electronic component is to be mounted, wherein
• said vacuum chuck hold the electronic component at a position which is on straight lines substantially parallel to more than two edges of the electronic component respectively and substantially perpendicular to the positioning mark of the electronic component, said vacuum chucking holes partially covering the electronic component, said vacuum chucking holes being located a vicinity of the positioning mark and avoiding the positioning mark so as to hold substantially all portions of the electronic component in engagement with said main electronic equipment holding unit.