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US 7,114,239 B2Granted
Method for manufacturing a thin-film magnetic head wafer
AssigneeNeomax Co., Ltd.
InventorTaisuke Hirooka
Life of this patent
Estimating the term…
Abstract
A thin-film magnetic head wafer includes a first principal surface and a second principal surface which are substantially parallel to each other. An electrical/magnetic transducer is provided on the first principal surface. Identification information is recorded on the first principal surface of the wafer.
Claims12
A method for manufacturing a thin-film magnetic head wafer on which identification information is recorded, the method comprising the steps of:
- preparing a ceramic wafer for a thin-film magnetic head, the wafer having a first principal surface for supporting an electrical/magnetic transducer and a second principal surface that are substantially parallel to each other;
- recording the identification information on the first principal surface of the wafer before the electrical/magnetic transducer is provided on the first principle surface, said identification information includes information that is unique to the wafer;
- depositing an insulating film on the first principal surface of the wafer so as to cover the identification information recorded thereon before the electrical/magnetic transducer is provided on the first principle surface;
- and
- planarizing the surface of the insulating film before the electrical/magnetic transducer is provided on the first principle surface;
- wherein
- the insulating film is arranged to separate the electrical/magnetic transducer from the ceramic wafer.
4 more elements
Dependencies are inferred from the claim text.