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US 7,113,101 B2Granted
Blister package with electronic content monitoring system
AssigneeIntelligent Devices, Inc.
InventorsMichael Petersen, Allan Wilson
Life of this patent
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AssigneeIntelligent Devices, Inc.
InventorsMichael Petersen, Allan Wilson
Estimating the term…
A replicate can be secured to a blister package intended to contain articles, such as pills, and is used to record the removal of individual articles from the blisters. To remove an article from a blister one will usually press against the blister to push the article through a frangible closure seal, breaking the seal in the process. The replicate includes a backing sheet which carries a plurality of traces alignable with corresponding blisters so that when the article is removed from the blister it will not only break the seal but it will also break the corresponding trace. All of the traces are connected to an integrated circuit which may also be formed or provided on the backing sheet, as is a power source for the integrated circuit. The breaking of the trace is an event that is recorded in the integrated circuit for later accessability. The replicate may be secured to the blister package after the package has been produced by conventional form-fill-seal equipment. The individual traces can be formed into a grid of closely spaced traces so that alignment of the traces with the individual blisters is less critical. The replicates may be formed by printing or other conventional methods on a roll of lidstock. After forming the individual replicates are severed from the roll of lidstock for securement to a blister package.
A replicate for application to a blister package containing a plurality of articles, each in an individual blister such that each such article can be projected through a corresponding portion of the package and the replicate for removal from the package, said replicate including a frangible backing sheet, an integrated circuit on said backing sheet, a power source for the integrated circuit, means for attaching said replicate to said package, and a plurality of individual electrically conductive traces on said backing sheet, said traces defining a grid pattern of intersecting sets of parallel such traces, said traces being positioned on said backing sheet so that more than one thereof will intersect each of said blisters when said replicate is attached to said package, said intersecting sets of traces being connected to said integrated circuit, whereby when an article is projected from its blister through said replicate the corresponding traces are broken, so as to define an event that can be recorded by said integrated circuit.
A blister package comprising:
A blister package comprising:
A blister package comprising:
Dependencies are inferred from the claim text.