Film deposition apparatus and film deposition method
AssigneeCanon Kabushiki Kaisha
InventorDaisuke Sasaguri
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Abstract
A film deposition apparatus for forming a film on a substrate includes a chamber capable of maintaining a reduced-pressure atmosphere. The chamber includes a control electrode, a substrate holder opposite to the control electrode, the substrate holder holding the substrate, and a filament for emitting electrons disposed between the substrate holder and the control electrode. The film deposition apparatus further includes a unit for controlling the potential applied to the control electrode to be lower than the potential applied to the filament and a unit for controlling the potential applied to the substrate to be higher than the potential applied to the filament.
Claims7
A film deposition method for forming a film on a substrate comprising the steps of:
- disposing a filament emitting electrons between a control electrode and a substrate spaced opposite to the control electrode;
- and
- heating the filament in a source gas atmosphere containing a source gas for forming the film, while applying a potential to the control electrode less than a potential applied to the filament and applying a potential to the substrate higher than the potential applied to the filament thereby forming the film on the substrate.
Dependencies are inferred from the claim text.