Method and apparatus for making very low roughness copper foil
AssigneeLG Cable Ltd.
InventorsCha Jae Jo, Chang Hee Choi, Sangyum Kim, Jeong Ik Kim
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Abstract
A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.
Claims16
A method for smoothing a copper foil, comprising:
- applying a positive current to the copper foil,
- applying a negative current to a first cathode plate in a first electrolytic polishing solution and a second cathode plate in a second electrolytic polishing solution,
- dipping the copper foil in the first electrolytic polishing solution, wherein a side of the copper foil faces the first cathode plate,
- removing the copper foil from the first electrolytic polishing solution, and
- dipping the copper foil in the second electrolytic polishing solution, wherein a side of the copper foil faces the second cathode plate;
- wherein
- the first electrolytic polishing solution is of a different temperature, acidity and/or corrosion inhibitor concentration from the second electrolytic polishing solution, and
- the second electrolytic polishing solution has a lower electrolytic polishing rate than the first electrolytic polishing solution.
A method for manufacturing a copper foil having very low roughness, the method comprising the steps of;
- pickling a copper foil (40) manufactured by electrodepositon or mechanical rolling within an acid pickling bath (100) containing an acid solution (100a) (S1000);
- electrolytic polishing the copper foil through electrolysis by applying a positive current to the copper foil (40) and by applying a negative current to the cathode plate (210) with dipping the copper foil (40) to face a cathode plate (210) within at least one electrolytic polishing bath (200) installed with the cathode plate and containing an electrolytic polishing solution (200a) (S2000);
- and
- washing the polished copper foil (40) within a water washing bath (300) containing water (S3000);
- wherein the electrolytic polishing step is performed at a gradually decreasing electrolytic polishing rate using a plurality of electrolytic polishing baths (200) containing the electrolytic polishing solutions (200a) of different electrolytic polishing rates, which electrolytic polishing solutions have different acidity(pH), temperature, and concentration of corrosion inhibitor.
Dependencies are inferred from the claim text.