Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
AssigneesKabushiki Kaisha Toshiba, Nof Corporation
InventorsHideaki Hirabayashi, Akiko Saito, Naoaki Sakurai, Yoshihiro Oshibe, Masahiro Ishidoya
Life of this patent
Estimating the term…
Abstract
There is disclosed a polishing cloth having an abrasive layer containing a polymer material which is a hydrolyzable with an aqueous medium and being capable of exhibiting a stable polishing performance for a relatively long period of time without necessitating a dressing treatment.
Claims21
A polishing cloth comprising an abrasive layer contacted with a subject member to be polished and comprising a polymer material which is hydrolyzable with an aqueous medium, and at least one abrasive grain selected from the group consisting of cerium oxide, manganese oxide, silica, alumina and zirconia, the abrasive grain being dispersed in the polymer material,
- wherein the polymer material comprises a backbone chain provided with a branched chain having a structure that can be hydrolyzed by an aqueous medium, and the structure being represented by the following formula (I) or (II):
- wherein R1, R2 and R3 may be the same or different and are individually a hydrogen atom, an alkyl group or an aryl group:
- wherein R4, R5 and R6 may be the same or different and are individually a hydrogen atom or an organic group having 1 to 18 carbon atoms;
- R7 is an organic group having 1 to 18 carbon atoms;
- and R6 and R7 may be connected together to form a heterocycle having Y1 as a heteroatom, Y1 being an oxygen atom or a sulfur atom.
A polishing apparatus comprising:
- a turntable having a surface which is covered with a polishing cloth having an abrasive layer, contacted with a subject member to be polished, containing a polymer material which is a hydrolyzable with an aqueous medium and at least one kind of abrasive grain selected from the group consisting of cerium oxide, manganese oxide, silica, alumina and zirconia, the abrasive grain being dispersed in the polymer material;
- holding means which is rotatively and vertically movably disposed over the turntable and is designed to hold the subject member, the holding means being also designed to impose a desired magnitude of load on the subject member to thereby enable the subject member to be press-contacted with the abrasive cloth of the turntable, and further designed to rotate in the same direction as that of the turntable;
- and
- feeding means for feeding a polishing composition containing at least water and abrasive grain free to the polishing cloth,
- wherein the polymer material comprises a backbone chain provided with a branched chain having a structure that can be hydrolyzed by an aqueous medium, and the structure being represented by the following formula (I) or (II):
- wherein R1, R2 and R3 may be the same or different and are individually a hydrogen atom, an alkyl group or an aryl group:
- wherein R4, R5 and R6 may be the same or different and are individually a hydrogen atom or an organic group having 1 to 18 carbon atoms;
- R7 is an organic group having 1 to 18 carbon atoms;
- and R6 and R7 may be connected together to form a heterocycle having Y1 as a heteroatom, Y1 being an oxygen atom or a sulfur atom.
Dependencies are inferred from the claim text.