Methods and apparatus for removing conductive material from a microelectronic substrate

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having methanol as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having ammonium chloride as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having a nitrile as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having an isonitrile as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having an aromatic hydrocarbon as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having a halocarbon as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less and having an alkoxide as a constituent;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material;
• and least restricting exposure of the electrolytic liquid to water.

A method for removing material from a microelectronic substrate, comprising disposing a microelectronic substrate and an electrolytic liquid in an enclosure, the enclosure at least restricting exposure of the microelectronic substrate and the electrolytic liquid to water;

• disposing the an electrolytic liquid between an electrically conductive material of the microelectronic substrate and at least one electrode, the electrolytic liquid having about 80% water or less;
• contacting the microelectronic substrate with a polishing pad material;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrically conductive material including at least one of tantalum and a tantalum compound, the electrolytic liquid having about 80% water or less and including a non-aqueous polar solvent that in turn includes methanol;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrically conductive material including at least one of tantalum and a tantalum compound, the electrolytic liquid having about 80% water or less and including a non-aqueous polar solvent and ammonium chloride;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• and
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrically conductive material including at least one of tantalum and a tantalum compound, the electrolytic liquid having about 80% water or less and including a non-aqueous polar solvent;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material;
• and
• at least restricting exposure of the electrolytic liquid to water.

A method for removing material from a microelectronic substrate, comprising

• disposing a microelectronic substrate and an electrolytic liquid in an enclosure, the enclosure at least restricting exposure of the microelectronic substrate and the electrolytic liquid to water;
• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode, the electrically conductive material including at least one of tantalum and a tantalum compound, the electrolytic liquid having about 80% water or less and including a non-aqueous polar solvent;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• moving at least one of the polishing pad material and the microelectronic substrate relative to the other;
• removing at least a portion of the conductive material from the microelectronic substrate while the electrolytic liquid is adjacent to the electrically conductive material.

A method for removing material from a microelectronic substrate, comprising:

• disposing an electrolytic liquid between an electrically conductive material of a microelectronic substrate and at least one electrode;
• electrically coupling the conductive material of the microelectronic substrate to a source of varying electrical signals via the electrolytic liquid and the at least one electrode;
• applying a varying electrical signal to the conductive material;
• at least restricting exposure of the electrolytic liquid to water;
• and
• removing at least a portion of the conductive material from the microelectronic substrate.

A method for removing material from a microelectronic substrate, comprising:

• contacting a microelectronic substrate with a polishing pad material, the microelectronic substrate having a conductive material;
• disposing an electrolytic liquid at an interface between the polishing pad material and the microelectronic substrate;
• applying a varying electrical current to the conductive material;
• moving at least one of the microelectronic substrate and the polishing pad material relative to the other;
• reducing a stability of an oxide of the conductive material by at least restricting exposure of the electrolytic liquid to water;
• removing at least a portion of the conductive material from the microelectronic substrate.

A method for removing material from a microelectronic substrate, comprising:

• contacting a microelectronic substrate with a polishing pad material, the microelectronic substrate having a conductive material;
• disposing an electrolytic liquid at an interface between the polishing pad material and the microelectronic substrate;
• applying a varying electrical current to the conductive material via the electrolytic liquid;
• moving at least one of the microelectronic substrate and the polishing pad material relative to the other;
• controlling a normal force between the polishing pad material and the microelectronic substrate by at least restricting exposure of the electrolytic liquid to water;
• and
• removing at least a portion of the conductive material from the microelectronic substrate.

A method for removing material from a microelectronic substrate, comprising:

• contacting a microelectronic substrate with a polishing pad material, the microelectronic substrate having at least one of tantalum and tantalum nitride;
• disposing an electrolytic liquid at an interface between the polishing pad material and the microelectronic substrate, the electrolytic liquid having 1% water or less;
• at least restricting exposure of the microelectronic substrate, the polishing pad material and the planarizing liquid to water with an enclosure disposed around the microelectronic substrate, the polishing pad and the electrolytic liquid;
• positioning first and second electrodes to be spaced apart from the microelectronic substrate and in fluid communication with the microelectronic substrate via the electrolytic liquid;
• applying a varying electrical current to at least one of the first and second electrodes;
• moving at least one of the microelectronic substrate and the polishing pad material relative to the other;
• applying a normal force between the polishing pad material and the microelectronic substrate of about 1.0 psi or less;
• and
• removing at least a portion of the conductive material from the microelectronic substrate.