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US 7,112,119 B1Granted
Sealed polishing pad methods
AssigneeApplied Materials, Inc.
InventorsBogdan Swedek, David J. Lischka, Jeffrey Drue David, Dominic J. Benvegnu
Life of this patent
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Abstract
A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.
Claims13
A method of making a polishing pad, comprising:
- securing a polishing layer with a polishing surface to a backing layer with a first portion that is permeable to liquid;
- forming an aperture in the backing layer aligned with a substantially fluid-impermeable element above the backing layer;
- and
- applying a sealant to penetrate a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid.
1 more element
Dependencies are inferred from the claim text.