Light emitting device and method of manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Toshimitsu Konuma, Takeshi Nishi
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Abstract
Technology to reduce the manufacturing cost of a manufacturing process of a light emitting device is provided. The manufacturing cost of a device using a light emitting element can be reduced by using a multilayout process for forming a plurality of light emitting devices from a large-sized substrate. In particular, an existing line for manufacturing liquid crystal cells can be diverted to a process of encapsulating light emitting elements, which can greatly reduce the manufacturing cost including the investment in plant and equipment.
Claims16
A method of manufacturing a light emitting device, comprising:
- forming a sealing material so as to surround at least a light emitting element over an insulator;
- adhering a covering material to said insulator by said sealing material;
- cutting a first part of said insulator and a first part of said covering material after said step of adhering said covering material;
- injecting an encapsulant in a portion surrounded by said insulator, said covering material, and said sealing material;
- and
- cutting a second part of said insulator and a second part of said covering material after said step of injecting said encapsulant.
A method of manufacturing a light emitting device, comprising:
- forming a first sealing material so as to surround at least a light emitting element over an insulator;
- adhering a covering material to said insulator by said first sealing material;
- cutting a first part of said insulator and a first part of said covering material after said step of adhering said covering material;
- injecting an encapsulant in a portion surrounded by said insulator, said covering material, and said first sealing material;
- cutting a second part of said insulator and a second part of said covering material after said step of injecting said encapsulant;
- attaching a connecting terminal over said insulator;
- and
- forming a second sealing material so as to abut an exposed portion of said first sealing material and a part of said connecting terminal.
A method of manufacturing a light emitting device, comprising:
- forming a sealing material so as to surround at least a light emitting element over an insulator;
- dropping encapsulant over said light emitting element;
- adhering a covering material to said insulator by said sealing material after said step of dropping said encapsulant, wherein the cover material is in contact with the sealing material;
- and
- cutting a part of said insulator and a part of said covering material after said step of adhering said covering material.
A method of manufacturing a light emitting device, comprising:
- forming a first sealing material so as to surround at least a light emitting element over a surface of a substrate;
- dropping encapsulant over said light emitting element;
- adhering a covering material to said substrate by said first sealing material after said step of dropping said encapsulant, wherein the cover material is in contact with the first sealing material;
- cutting a part of said substrate and a part of said covering material after said step of adhering said covering material;
- attaching a connecting terminal over said substrate;
- and
- forming a second sealing material so as to abut an exposed portion of said first sealing material and a part of said connecting terminal.
Dependencies are inferred from the claim text.