Inkjet printhead integrated circuit
AssigneeSilverbrook Research Pty Ltd
InventorKia Silverbrook
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AssigneeSilverbrook Research Pty Ltd
InventorKia Silverbrook
Estimating the term…
An inkjet printhead integrated circuit is provided. The integrated circuit comprises a plurality of nozzle arrangements, each nozzle arrangement comprising a nozzle chamber and an ink ejection member positioned in the nozzle chamber. The ink ejection member is displaceable with respect to the substrate. An actuator is connected to drive circuitry in the integrated circuit and is reciprocally displaceable upon receipt of an electrical signal. A lever mechanism interconnects the ink ejection member and the actuator. The lever mechanism comprises: (a) an effort end operatively connected to the actuator, the effort end being separate from the substrate; (b) a load end operatively connected to the ink ejection member; and (c) a fulcrum positioned between the effort end and the load end. The lever mechanism is pivotal with respect to the substrate about the fulcrum such that movement of the effort end due to the actuator imparts reciprocal movement to the load end. The reciprocal movement is, in turn, imparted to the ink ejection member.
An inkjet printhead integrated circuit comprising
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Typewriters or selective printing mechanisms having dual functions or combined with, or coupled to, apparatus performing other functions: printers…
Structure thereof only for on-demand ink jet heads: structure of ink jet print heads with thermal bend detached actuators
Production of nozzles: production of bubble jet print heads
Manufacturing processes: bonding and adhesion
Term ended 14 Sep 2018 (estimated)
This invention relates to an inkjet printhead chip. More particularly, this invention relates to an inkjet printhead chip which incorporates micro-mechanical lever mechanisms.
The following patents/patent applications are incorporated by reference.
The following patents/patent applications are incorporated by reference.
In the drawings,
FIG. 1 shows a sectioned, three dimensional view of a nozzle arrangement of a printhead chip, in accordance with the invention, for an inkjet printhead; and
FIG. 2 shows a three dimensional view of the nozzle arrangement of FIG. 1.
In the drawings, reference numeral 10 generally indicates a nozzle arrangement for a first embodiment of an ink jet printhead chip, in accordance with the invention.
The nozzle arrangement 10 is one of a plurality of such nozzle arrangements formed on a silicon wafer substrate 12 to define the printhead chip of the invention. As set out in the background of this specification, a single printhead can contain up to 84 000 such nozzle arrangements. For the purposes of clarity and ease of description, only one nozzle arrangement is described. It is to be appreciated that a person of ordinary skill in the field can readily obtain the printhead chip by simply replicating the nozzle arrangement 10 on the wafer substrate 12.
The printhead chip is the product of an integrated circuit fabrication technique. In particular, each nozzle arrangement 10 is the product of a MEMS—based fabrication technique. As is known, such a fabrication technique involves the deposition of functional layers and sacrificial layers of integrated circuit materials. The functional layers are etched to define various moving components and the sacrificial layers are etched away to release the components. As is known, such fabrication techniques generally involve the replication of a large number of similar components on a single wafer that is subsequently diced to separate the various components from each other. This reinforces the submission that a person of ordinary skill in the field can readily obtain the printhead chip of this invention by replicating the nozzle arrangement 10.