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US 7,111,666 B2Granted
Heat sink
AssigneeHewlett-Packard Development Company, L.P.
InventorsRoy M. Zeighami, Christian L Belady
Life of this patent
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Abstract
A heat sink is constructed including at least one heat sink fin. Each fin includes an opening sized to fit a thermal device when the fins are heated to a temperature above that of the thermal device. When the fins cool to the temperature of the thermal device they shrink in size and form a tight compression fit around the thermal device.
Claims3
A heat sink assembly comprising:
- a heat pipe
- at least one heat sink fin including an opening;
- wherein said opening has a first area when said at least one heat sink fin is at a first temperature, and has a second area when said at least one heat sink fin is at a second temperature, wherein said first area is smaller than said second area when said first temperature is lower than said second temperature;
- and
- wherein said opening is configured such that said first area is slightly smaller than a cross-section of said heat pipe when said heat pipe is at said first temperature and said second area is larger than a cross-section of said heat pipe when said heat pipe is at said first temperature;
- and
- wherein said at least on heat sink fin forms a compression fit with said heat pipe when said heat sink fin is cooled to said first temperature, after said heat pipe has been inserted into said opening while said heat sink fin was at said second temperature.
4 more elements
Dependencies are inferred from the claim text.