Lead plating method for GMR head manufacture
AssigneeHeadway Technologies, Inc.
InventorsChao-Peng Chen, Kevin Lin, Jei-Wei Chang, Kochan Ju, Hui-Chuan Wang
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AssigneeHeadway Technologies, Inc.
InventorsChao-Peng Chen, Kevin Lin, Jei-Wei Chang, Kochan Ju, Hui-Chuan Wang
Estimating the term…
A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.
A process for forming leads to a magnetic read head, comprising:
A process for forming leads to a magnetic read head, comprising:
Dependencies are inferred from the claim text.