BTE/CIC auditory device and modular connector system therefor

A method for providing a plurality of earpiece auditory device components, a portion of which may be assembled to form an earpiece auditory device tailored to a user, said method comprising:

• providing a selected behind-the-ear (BTE) component operable to facilitate the user's intended use for the earpiece auditory device may be selected, wherein said BTE component comprises a module including processing circuitry;
• providing a selected completely-in-canal (CIC) component, said selected CIC component being shaped to fit into the ear canal of the user, wherein said selected CIC component comprises an ear mold and a speaker, said speaker being encased in a speaker module;
• and
• providing a connector of sufficient length to physically couple said selected BTE component when said selected BTE component is placed behind the ear of the user to said selected CIC component when said CIC component is placed inside the ear canal of the user, wherein said connector of sufficient length includes a proximal end physically and communicatively operable to couple to said BTE component and a distal end physically and communicatively operable to couple to said CIC component, said connector of sufficient length being sufficiently rigid so as to allow said connector of sufficient length to be used to insert and remove said selected CIC component;
• wherein said speaker module is detachably physically interconnectable with said ear mold.

An auditory device comprising:

• a processing module comprising audio processing circuitry;
• an in-the-canal (ITC) component, wherein said ITC component comprises an ear mold and a speaker, said speaker being encased in a speaker module;
• and
• a connector physically and communicatively coupling said processing module component to said ITC component, said connector having a proximal end physically and communicatively coupled to said processing module and a distal end physically and communicatively coupled to said ITC component;
• wherein said speaker is interconnected detachably with said ear mold through a locking pin assembly.