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US 7,109,581 B2Granted
System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
AssigneeNanoconduction, Inc.
InventorsCarlos Dangelo, Meyya Meyyappan, Jun Li
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Abstract
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
Claims24
A micro-cooler device structure comprising:
- a heat sink body having a heat sink surface;
- a plurality of individually separated, rod like nano-structures for transferring thermal energy from a surface of at least one integrated circuit chip to said heat sink surface, said plurality of individually separated, rod-like nano-structures being disposed between said heat sink surface and said surface of at least one integrated circuit chip;
- and,
- a thermally conductive metallic material disposed within interstitial voids between said plurality of individually separated, rod-like nano-structures.
1 more element
A method for fabricating a micro-cooler device, comprising:
- fashioning a heat spreading cavity in a mounting surface of a heat sink body;
- growing individually separated, rod-like nano-structures within said cavity;
- and,
- depositing a thermally conductive material in interstitial voids between said rod-like nano-structures.
1 more element
Dependencies are inferred from the claim text.