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US 7,105,123 B2Granted
Heat dissipation device for and method of dissipating heat from a manifold
AssigneeMold-Masters Limited
InventorRobert Trudeau
Life of this patent
Estimating the term…
Abstract
An injection molding apparatus comprising a hot runner manifold, a heater coupled to the manifold and a heat dissipation device coupled to said manifold, wherein said heat dissipation device reduces hot spots on said manifold caused by uneven heating.
Claims29
An injection molding apparatus comprising:
- a hot runner manifold;
- a heater coupled to said manifold;
- and
- a heat dissipation device, having a first end coupled to said manifold between said manifold and a cooler member, said cooler member having a lower temperature than said manifold;
- wherein said heat dissipation device thermally expands and contacts said cooler member when a temperature of said manifold at said pre-determined location increases above a predetermined temperature.
2 more elements
An injection molding apparatus, comprising:
- a manifold;
- a heater coupled to said manifold;
- and
- a heat dissipation device coupled to said manifold, said heat dissipation device having a first spacial orientation when said manifold has a temperature below a predetermined temperature and a second spacial orientation when said manifold has a temperature greater than a predetermined temperature, wherein said first and second orientations differ in that said second orientation contacts an adjacent cooler member.
1 more element
A method of locally cooling a manifold of an injection molding apparatus comprising:
- measuring the temperature of said manifold;
- identifying high temperature locations on a surface of said manifold;
- coupling a first end of a heat dissipation device to said surface of said manifold at said high temperature locations;
- positioning a second end of said heat dissipation device such that thermal expansion causes said second end to come into contact with a cooler member when the temperature of said surface at said high temperature locations increases to a predetermined temperature;
- and
- heating said manifold surface to a temperature greater than said predetermined temperature.
3 more elements
A heat dissipation device for use with a hot runner manifold apparatus, comprising:
- a first end thermally coupled with a hot runner manifold, a second end and one or more thermally conductive layers,
- wherein said second end of said heat dissipation device thermally expands and contacts a cooler portion of said manifold apparatus only at temperatures above a predetermined temperature.
A method of dissipating heat from a manifold of an injection molding apparatus, comprising:
- providing an injection molding apparatus including a manifold;
- providing a manifold backing plate adjacent but not contacting said manifold;
- providing at least one heat dissipation device having a first end and a second end;
- coupling said first end to said manifold;
- directing heat away from said manifold by allowing said heat dissipation device to thermally expand and contact said manifold backing plate when said manifold temperature increases beyond a predetermined temperature.
2 more elements
Dependencies are inferred from the claim text.