US 7,104,312 B2 · Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Abstract

A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

Claims165

Dependent claims

a. channeling a selectable, non-uniform amount of a first temperature fluid to one or more predetermined locations on the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface;
and
b. channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source.

A hermetic closed loop system for controlling a temperature of a heat source comprising:

a. at least one heat exchanger for controlling the temperature of the heat source by channeling selectable, non-uniform amounts of a fluid to one or more predetermined locations on the heat source, wherein the heat exchanger is configured to minimize temperature differences in the heat source;
b. at least one pump for circulating fluid throughout the loop, the at least one pump coupled to the at least one heat exchanger;
and
c. at least one heat rejector coupled to the at least one pump and the at least one heat exchanger.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/698,304Filed 30 Oct 2003 · us provisional application

Priority

1 Nov 2002

Published

US 2004/0112585 A117 Jun 2004

Granted

12 Sep 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

F28F 3/048
The means being integral with the element: in the form of ribs integral with the element or local variations in thickness of the element, e.g.…
F04B 19/006
Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00: micropumps
F28D 15/00
Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into
F28F 3/12
Plate-like or laminated elements; Assemblies of plate-like or laminated elements: elements constructed in the shape of a hollow panel, e.g. with…

Family

Application60/423,009Us provisional application · filed 1 Nov 2002

Application60/442,383Us provisional application · filed 24 Jan 2003

Application60/455,729Us provisional application · filed 17 Mar 2003

Application60/462,245Us provisional application · filed 11 Apr 2003

US 2004/0112585 A1Pre-grant publication · published 17 Jun 2004

US 7,104,312 B2This patent

From the US filing history. Foreign family members aren’t listed.

Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Life of this patent

Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Life of this patent

Abstract

Claims165