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US 7,102,520 B2Granted
RFID device and method of forming
AssigneeAvery Dennison Corporation
InventorsPeikang Liu, Jason Munn, Thomas Craig Weakley, Ian J. Forster
Life of this patent
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Abstract
A radio frequency identification (RIFD) inlay includes an interposer that has a chip, and an antenna on an antenna substrate. The antenna substrate has a recess or hole, and the chip is at least partially in the recess or hole. By placing the chip or the interposer face down and at least partially in a recess or hole, thickness of the inlay may be reduced.
Claims25
A radio frequency identification (REID) device comprising:
- an antenna substrate having at least a recess therein;
- an antenna on the antenna substrate;
- and
- an interposer, wherein the interposer includes:
- an RFID chip having contacts thereupon;
- and
- interposer leads operatively coupled to the contacts of the chip;
- wherein the interposer leads and the antenna are electrically coupled together;
- wherein at least part of the interposer is within the at least a recess;
- and
- wherein the interposer leads and the antenna are capacitively coupled together across a dielectric material.
8 more elements
A method of forming an RFID device, the method comprising:
- forming an interposer, wherein the forming includes electrically coupling interposer leads of the interposer to contacts of an RFID chip of the interposer;
- forming at least a recess in an antenna substrate that has an antenna thereupon;
- and
- subsequent to the forming at least a recess, mechanically coupling the interposer and the antenna substrate together;
- wherein the mechanically coupling includes placing at least part of the chip in the at least a recess;
- and
- wherein the mechanically coupling also includes capacitively coupling the interposer leads and the antenna.
4 more elements
Dependencies are inferred from the claim text.