Exposure method, exposure apparatus, and method for manufacturing device
AssigneeNikon Corporation
InventorsHiroyuki Nagasaka, Takashi Aoki
Life of this patent
Estimating the term…
Abstract
According to one embodiment of the invention, a pattern of a mask is transferred onto a substrate via a projection optical system using an energy beam by placing a substrate on side of an energy beam emitting end portion of projection optical system, when the substrate is exposed, and placing an object on the side of the energy beam emitting end portion of the projection optical system in place of the substrate when the substrate is exchanged. This can adequately remove a light absorptive substance from the region near an output end of the projection optical system and can maintain the gas state even at a time of moving or replacing the substrate.
Claims35
An exposure method for forming a pattern onto a substrate via a projection optical system using an energy beam, the method comprising the steps of:
- placing a substrate stage under the projection optical system;
- moving an object so that the object is close to the substrate stage;
- and
- placing the object under the projection optical system in place of the substrate stage by moving the object together with the substrate stage under a condition such that the object is disposed close to the substrate stage.
An exposure apparatus for forming a pattern onto a substrate via a projection optical system using an energy beam, the exposure apparatus comprising:
- a substrate stage disposed under the projection optical system;
- a first driver connected to the substrate stage and that drives the substrate stage;
- an object that can be disposed under the projection optical system in place of the substrate stage;
- a second driver connected to the object and that drives the object;
- and
- a controller connected to the first and second drivers and that causes the object to move together with the substrate stage under a condition such that the object is disposed close to the substrate stage so that the object is placed under the projection optical system.
An exposure apparatus for forming a pattern onto a substrate via a projection optical system, the exposure apparatus comprising:
- a first substrate stage that is placed under the projection optical system so as to expose a first substrate on the first substrate stage with an energy beam;
- and
- a second substrate stage that is placed under the projection optical system in place of the first substrate stage by moving the second substrate stage together with the first substrate stage under a condition such that the second substrate stage is disposed close to the first substrate stage, so as to expose the second substrate on the second substrate stage with the energy beam, after completing the exposure of the first substrate.
An exposure apparatus for forming a pattern onto a substrate via a projection optical system, the exposure apparatus comprising:
- a first substrate stage that is placed under the projection optical system so as to expose a first substrate on the first substrate stage with an energy beam;
- a second substrate stage that is placed under the projection optical system in place of the first substrate stage so as to expose a second substrate on the second substrate stage with the energy beam;
- and
- a spare stage that is disposed between the first substrate stage and the second substrate stage, wherein:
- the second substrate stage is placed under the projection optical system in place of the first substrate stage by moving the second substrate stage together with the first substrate stage and the spare stage under a condition such that the second substrate stage and the spare stage are disposed close to the first substrate stage, after completing the exposure of the first substrate.
An exposure method for forming a pattern onto a substrate via a projection optical system using an energy beam, the method comprising the steps of:
- placing a first substrate stage under the projection optical system so as to expose a first substrate on the first substrate stage with the energy beam;
- moving a second substrate stage so that the second substrate stage is close to the first substrate stage, so as to expose a second substrate on the second substrate stage with the energy beam after completing the exposure of the first substrate;
- moving the second substrate stage together with the first substrate stage under a condition such that the second substrate stage is disposed close to the first substrate stage;
- and
- placing the second substrate stage under the projection optical system in place of the first substrate stage.
An exposure method for forming a pattern onto a substrate via a projection optical system using an energy beam, the method comprising the steps of:
- placing a first substrate stage under the projection optical system so as to expose a first substrate on the first substrate stage with the energy beam;
- providing a second substrate stage that holds a second substrate so as to expose the second substrate with the energy beam;
- disposing a spare stage between the first substrate stage and the second substrate stage after completing the exposure of the first substrate;
- moving the spare stage close to the first substrate stage and moving the second substrate stage close to the spare stage;
- moving the second substrate stage together with the first substrate stage and the spare stage under a condition such that the second substrate stage is disposed close to the first substrate stage and the spare stage;
- and
- placing the second substrate stage under the projection optical system in place of the first substrate stage.
An exposure method for transferring a pattern of a mask onto a substrate via a projection optical system using an energy beam, wherein a light absorbing substance that absorbs the energy beam is removed from a periphery of the substrate via a piping mouth that moves together with the substrate so as to maintain a condition under which the energy beam can be transmitted through a space between the substrate and an energy beam emission end of the projection optical system.
An exposure apparatus for transferring a pattern of a mask onto a substrate via a projection optical system using an energy beam, the exposure apparatus comprising a piping mouth that moves together with the substrate and removes a light absorbing substance that absorbs the energy beam from a periphery of the substrate so as to maintain a condition under which the energy beam can be transmitted through a space between the substrate and an energy beam emitting end portion of the projection optical system.
An exposure method for transferring a pattern of a mask onto a substrate via a projection optical system using an energy beam, the method comprising the steps of:
- removing a light absorbing substance that absorbs an energy of the energy beam from a space between the substrate and an energy beam emitting end portion of the projection optical system through which the energy beam should be transmitted when the substrate is exposed by the energy beam;
- and
- disposing an exhausting duct that has an exhausting mouth near the energy beam emitting end portion of the projection optical system instead of the substrate when the substrate is moved or exchanged so as to exhaust the light absorbing substance via the exhausting mouth.
An exposure apparatus for transferring a pattern of a mask onto a substrate via a projection optical system using an energy beam, the exposure apparatus comprising an exhausting duct that has an exhausting mouth that exhausts a light absorbing substance near an energy beam emitting end portion of the projection optical system so as to maintain a condition under which the light absorbing substance that absorbs the energy of the energy beam near the energy beam emitting end portion of the projection optical system not only when the substrate is exposed by the energy beam but also when the substrate is moved or exchanged.
Dependencies are inferred from the claim text.