Hard disk drive comprising flexible printed circuit with damping material
AssigneeSamsung Electronics Co., Ltd.
InventorSang-chul Shin
Life of this patent
Estimating the term…
Abstract
A hard disk drive including a flexible printed circuit (FPC) in which a base layer and a cover layer are arranged with a circuit layer therebetween. In addition, a damping material is coupled at a predetermined portion of the signal patterns in the circuit layer so as to cross the signal patterns. The hard disk drive reduces vibration energy over an entire frequency band to minimize the effect of vibration on servo control and improve the performance of the hard disk drive.
Claims16
A hard disk drive having an actuator with a magnetic head to write and read information to/from a disk, a voice coil motor to drive the actuator, a flexible printed circuit (FPC) to transfer electrical signals to the actuator and the voice coil motor, and a bracket to support the FPC, the hard disk drive comprising:
- the FPC having a base layer and a cover layer arranged with a circuit layer therebetween;
- and
- a damping material coupled at predetermined portion(s) of signal patterns on the circuit layer and crossing the signal patterns,
- wherein the damping material is added at a frequency band centered around 340 Hz to reduce vibration energy at under 1 kHz.
A hard disk drive having an actuator to write and read information to/from a disk and a voice coil motor to drive the actuator, the hard disk drive further comprising:
- a bracket connected to a printed circuit board (PCB);
- and
- a flexible printed circuit (FPC) formed of signal patterns and connected to the POB at one end through the bracket and to the actuator at the other end,
- wherein a damping material is coupled to a portion of the FPC along a length of the FPC between ends thereof next to a junction of the FPC and the bracket.
A hard disk drive comprising:
- a flexible printed circuit (FPC) having first and second layers arranged with a circuit layer therebetween;
- a damping material, located between the first and second layers, and coupled at predetermined portions of signal patterns on the circuit layer and crossing the signal patterns;
- and
- an adhesive adhering the first and second layers,
- wherein the damping material is added at a frequency band centered around 340 Hz to reduce vibration energy at under 1 kHz.
Dependencies are inferred from the claim text.