Substrate having a planarization layer and method of manufacture therefor, substrate for electro-optical device, electro-optical device, and electronic apparatus

A substrate for an electro-optical device having a planarization layer, comprising:

• a substrate having a plurality of recesses in regions of the substrate surface;
• a plurality of sub-interlayer-film wiring patterns formed in film formation layers disposed in at least one of the regions of the recesses and other regions;
• interlayer films formed on the plurality of sub-interlayer-film wiring patterns, at least one of the interlayer films having a planarized surface;
• a plurality of contact holes formed in the planarized interlayer film corresponding to portions of the plurality of sub-interlayer-film wiring patterns;
• and
• a stacked film which is formed between the substrate and the plurality of sub-interlayer-film wiring patterns, values obtained by subtracting the sunken distance of the recesses along the normal direction of the substrate surface from the thickness of the stacked film portions corresponding to each region of the plurality of contact holes being equal or nearly equal.

A substrate having a planarization layer, comprising:

• a plurality of film formation layers where film formation patterns are formed, respectively;
• interlayer films formed between the plurality of film formation layers, respectively;
• a plurality of sub-interlayer-film wiring patterns formed in the film formation layers beneath a planarized interlayer films of the interlayer films;
• a plurality of contact holes formed in the planarized interlayer films and connecting the plurality of sub-interlayer-film wiring patterns and film formation patterns of layers above the planarized interlayer films;
• and
• one or more dummy patterns formed in a plurality of positions below the plurality of contact holes, and formed in one or more of the film formation layers under the plurality of sub-interlayer-film wiring patterns, respectively, so as to control positions of the surfaces of the plurality of sub-interlayer-film wiring patterns.

A method of manufacturing a substrate having a planarization layer, comprising:

• forming one or more dummy patterns at one or more positions of one or more film formation layers in the same step as a forming each film formation pattern of a plurality of film formation layers to be stacked, respectively;
• forming interlayer films on the film formation layers;
• forming a plurality of sub-interlayer-film wiring patterns in wiring layers of the plurality of film formation layers;
• planarizing at least one of the interlayer films formed on the wiring layers;
• and
• forming a plurality of contact holes to connect the plurality of sub-interlayer-film wiring patterns and a plurality of film formation patterns of layers above the plurality of interlayer films in the planarized interlayer films at a plurality of positions on the dummy patterns,
• the dummy patterns controlling the vertical positions of the surfaces of the plurality of sub-interlayer-film wiring patterns.

A substrate for an electro-optical device, comprising:

• a pixel electrode layer where a film formation pattern of pixel electrodes is formed corresponding to each intersection of a plurality of data lines and a plurality of scan lines which are arranged planarly in a matrix;
• a first film formation layer where a film formation pattern of the plurality of data lines is formed;
• a second film formation layer where a film formation pattern of the plurality of scan lines and a film formation pattern of switching elements for supplying signals to the pixel electrodes are formed;
• interlayer films which are formed between the pixel electrode layer, the first film formation layer, and the second film formation layer, respectively;
• a plurality of sub-interlayer-film wiring patterns which are formed in film formation layers beneath a planarized interlayer films of the interlayer films, and which are formed in any one of the pixel electrode layer, the first film formation layer, the second film formation layer, and the other film formation layers;
• a plurality of contact holes which are formed in the planarized interlayer films in order to connect the plurality of sub-interlayer-film wiring patterns and the film formation patterns of layers above the planarized interlayer films;
• and
• one or more dummy patterns which are formed at a plurality of positions under the plurality of contact holes, and which are formed in one or more film formation layers of layers below the plurality of sub-interlayer-film wiring patterns, respectively so as to control the positions of the surfaces of the plurality of sub-interlayer-film wiring patterns.