Process independent alignment marks
AssigneeLSI Logic Corporation
InventorsDavid W. Daniel, James R. B. Elmer
Life of this patent
Estimating the term…
Abstract
An apparatus for aligning a mask having an image and at least one complimentary alignment mark to a substrate having a first surface and a substantially opposing second surface. The substrate further has at least one alignment mark on the second surface. A mask support supports the mask in proximity to the first surface of the substrate. A substrate support supports the substrate with the first surface in proximity to the mask. An alignment means aligns the at least one alignment mark on the second surface of the substrate to the at least one complimentary alignment mark on the mask. An exposure source projects the image of the mask onto the first surface of the substrate, and a controller controls the mask support, substrate support, alignment means, and exposure source.
Claims7
An apparatus for aligning a mask having an image and at least one complimentary alignment mark to a substrate having a first surface and a substantially opposing second surface, the substrate further having at least one alignment mark on the second surface, the apparatus comprising:
- a mask support for supporting the mask in proximity to the first surface of the substrate,
- a substrate support for supporting the substrate with the first surface in proximity to the mask,
- an alignment means for aligning a real time image of the at least one alignment mark on the second surface of the substrate to a real time image of the at least one complimentary alignment mark on the mask,
- an exposure source for projecting the image of the mask onto the first surface of the substrate, and
- a controller for controlling the mask support, substrate support, alignment means, and exposure source.
A method for aligning a mask having an image and at least one complimentary alignment mark to a substrate having a first surface and a substantially opposing second surface, the substrate further having at least one alignment mark on the second surface, the method comprising the steps of:
- disposing the mask in proximity to the first surface of the substrate,
- creating a real time image of the at least one alignment mark,
- creating a real time image of the at least one complimentary alignment mark,
- moving at least one of the mask and the substrate relative to the other and aligning the real time image of the at least one alignment mark to the real time image of the at least one complimentary alignment mark, and
- projecting the image of the mask onto the first surface of the substrate.
Dependencies are inferred from the claim text.