In-tray burn-in board, device and test assembly for testing integrated circuit devices in situ on processing trays

A device for burn-in and electrical testing of a plurality of integrated circuit devices disposed in a two-dimensional array of cells on at least one processing tray in positions wherein leads of each integrated circuit device of the plurality of integrated circuit devices are accessible from above, the device comprising:

• a burn-in board having a substantially planar interface surface;
• and
• a plurality of electrical contacts disposed in groups on the substantially planar interface surface of the burn-in board, the groups of electrical contacts of the plurality of electrical contacts being located on the substantially planar interface surface and arranged and configured for establishing direct electrical communication from above with an intergrated circuit device, at least some electrical contacts being laterally disposed within a boundary defined by a peripheral edge of the intergrated circuit device when direct electrical communication is established between the electrical contacts and the intergrated circuit device;
• and
• at least one socket removably attached to the substantially planar interface surface, the at least one socket comprising at least one group of electrical contacts of the plurality of electrical contacts.