Semiconductor encapsulating epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsShoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
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Abstract
A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
Claims9
A semiconductor encapsulating flame retardant epoxy resin composition which is free of halogenated epoxy resins and of antimony compounds, said composition comprising:
- (A) an epoxy resin,
- (B) a phenolic resin curing agent,
- (C) zinc molybdate supported on an inorganic carrier,
- (D) at least one organopolysiloxane (D-iii) block copolymer obtained by reacting an epoxy resin or an alkenyl group-bearing epoxy resin with an organopolysiloxane of the following average compositional formula (2):
- HmR2nSiO(4−m−n)/2 (2)
- wherein R2 is a substituted or unsubstituted monovalent hydrocarbon group, m is a positive number of 0.001 to 0.2, n is a positive number of 1.8 to 2.1, and m+n is 1.801 to 2.3, the number of silicon atoms in a molecule is an integer of 10 to 1000, and the number of hydrogen atoms directly attached to silicon atoms is 1 to 5, addition reaction taking place between epoxy groups on the epoxy resin or alkenyl groups on the alkenyl group-bearing epoxy resin and silicon-attached hydrogen atoms on the organopolysiloxane, and
- (E) an inorganic filler.
Dependencies are inferred from the claim text.