Light emitting diode apparatuses with heat pipes for thermal management
AssigneeGELcore, LLC
InventorsMehmet Arik, Stanton Earl Weaver, Jr., Charles Becker
Life of this patent
Estimating the term…
Abstract
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.
Claims18
A light emitting apparatus comprising:
- one or more light emitting diode chips;
- and
- a passive heat pipe including (i) a generally planar chip support wall on which the one or more light emitting diode chips are disposed, (ii) at least one additional wall sealed with the chip support wall to define a closed interior volume, (iii) a heat transfer fluid disposed in the closed interior volume, and (iv) one or more wicking structures disposed at least on an interior surface of the chip support wall, the portion of the wicking structure disposed on the interior surface of the chip support wall including radiating wicks radiating outward toward edges of the chip support wall.
The A light emitting apparatus comprising:
- one or more light emitting diode chips;
- and
- a passive heat pipe including (i) a generally planar chip support wall on which the one or more light emitting diode chips are disposed, (ii) at least one additional wall sealed with the chip support wall to define a closed interior volume, (iii) a heat transfer fluid disposed in the closed interior volume, and (iv) one or more wicking structures disposed at least on an interior surface of the chip support wall, the chip support wall of the passive heat pipe including a metal core sealed with at least one additional wall to define the closed interior volume, one or more insulating layers disposed on the metal core, and printed circuitry disposed on or between the one or more insulating layers and electrically connecting with the at least one light emitting diode chip.
A light emitting apparatus comprising:
- one or more light emitting diode chips;
- a metal core printed circuit board on which the light emitting diode chips are disposed, the metal core printed circuit board including printed circuitry connecting with the light emitting diode chips;
- and
- a heat pipe having walls including a metal core of the metal core printed circuit board sealed with at least one additional wall to define a sealed volume of the heat pipe, the heat pipe further including a heat transfer fluid disposed in the sealed volume.
A light emitting apparatus comprising:
- at least one light emitting diode chip;
- and
- a passive heat pipe having a sealed volume defined by (i) a chip support wall on which the at least one light emitting diode chip is disposed, (ii) a backside wall, and (iii) one or more sidewalls extending between the chip support wall and the backside wall, a separation between the chip support wall and the backside wall being smaller than a lateral dimension of the chip support wall, the heat pipe further including a heat transfer fluid disposed in the sealed volume.
Dependencies are inferred from the claim text.