Optical fiber terminator package
AssigneeSilverbook Research Pty Ltd
InventorKia Silverbrook
Life of this patent
Estimating the term…
Abstract
An optical fiber terminator package is provided. The package comprises: (a) a semiconductor chip having a top surface and a bottom surface; (b) at least one optical device positioned on or in the top surface; and (c) a first hollow cap bonded to the top surface and positioned at least partially over the at least one optical device. The first hollow cap is a one-piece molded cap and comprises: (i) a roof and sidewalls extending therefrom to the top surface; (ii) a first region in the roof which is substantially transparent to electromagnetic radiation; and (iii) at least one attachment means for attaching a optical fiber to the first hollow cap.
Claims8
An optical fiber terminator package comprising:
- (a) a semiconductor chip having a top surface and a bottom surface;
- (b) at least one optical device positioned on or in the top surface;
- and
- (c) a first hollow cap bonded to the top surface and positioned at least partially over the at least one optical device, the first hollow cap being a one-piece molded cap comprising:
- (i) a roof and sidewalls extending therefrom to the top surface;
- (ii) a first region in the roof which is substantially transparent to electromagnetic radiation;
- and
- (iii) a recess in said first region, the recess directly receiving an optical fiber.
Dependencies are inferred from the claim text.