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US 7,095,108 B2Granted
Array capacitors in interposers, and methods of using same
AssigneeIntel Corporation
InventorCengiz A. Palanduz
Life of this patent
Estimating the term…
Abstract
A chip package is made with the ring or dish interposer and an embedded array capacitor. A computing system is also disclosed that includes the ring or dish interposer and the embedded array capacitor.
Claims23
An interposer comprising:
- an array capacitor including a die-side surface, a board-side surface and a lateral surface;
- and
- an interposer body, wherein the interposer body exposes at least part of the die-side surface, and wherein the interposer body substantially encompasses the lateral surface.
A package comprising:
- a microelectronic die;
- an interposer disposed beneath the microelectronic die, the interposer including:
- an array capacitor including a die-side surface, a board-side surface and a lateral surface;
- and
- an interposer body, wherein the interposer body exposes at least part of the die-side surface, wherein the interposer body substantially encompasses the lateral surface;
- and
- a mounting substrate disposed beneath the interposer.
4 more elements
A process comprising:
- placing an array capacitor within an interposer body, wherein the array capacitor includes a die-side surface, a board-side surface and a lateral surface, wherein the interposer body exposes at least part of the die-side surface, and wherein the interposer body substantially encompasses the lateral surface.
A computing system comprising:
- a microelectronic die;
- an interposer disposed beneath the microelectronic die, the interposer including:
- an array capacitor including a die-side surface, a board-side surface and a lateral surface;
- and
- an interposer body, wherein the interposer body exposes at least part of the die-side surface, wherein the interposer body substantially encompasses the lateral surface;
- and
- at least one of an input device and an output device.
4 more elements
Dependencies are inferred from the claim text.