Group III nitride compound semiconductor device
AssigneeToyoda Gosei Co., Ltd.
InventorsToshiya Uemura, Atsuo Hirano, Shigemi Horiuchi
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AssigneeToyoda Gosei Co., Ltd.
InventorsToshiya Uemura, Atsuo Hirano, Shigemi Horiuchi
Estimating the term…
The present invention provides a Group III nitride compound semiconductor device in which the amount of a current allowed to be applied on a p-type pad electrode can be increased. That is, in the Group III nitride compound semiconductor device according to the present invention, a portion of a translucent electrode coming in contact with a circumferential surface of the p-type pad electrode is formed as a thick port ion to thereby increase the area of contact between the circumferential surface and the translucent electrode to thereby increase the current allowed to be applied on the p-type pad electrode. In addition, the use of the thick portion prevents cracking from occuring between the translucent electrode and the circumferential surface of the pad electrode.
A Group III nitride compound semiconductor device, comprising:
A translucent electrode in a Group III nitride compound semiconductor device, comprising:
A p-type electrode structure, comprising:
A Group III nitride compound semiconductor device comprising:
A p-type electrode structure, comprising:
Dependencies are inferred from the claim text.