Light emitting diodes packaged for high temperature operation

A packaged LED for high temperature operation comprising:

• a metal base, the metal base including an underlying thermal connection pad and a pair of underlying electrical connection pads;
• a layer of ceramic overlying the metal base;
• and
• an LED having a pair of electrodes overlying the metal base, wherein the LED is thermally coupled through the metal base to the thermal connection pad and at least one electrode is electrically connected to at least one of the underlying electrical connection pads by an electrical path including an insulated conducting via through the metal base.

A packaged LED for high temperature operation comprising:

• a metal base, the metal base including an underlying thermal connection pad and a pair of underlying electrical connection pads;
• a layer of electrically insulating material overlying the metal base;
• and
• an LED mounted on the layer of electrically insulating material, wherein the LED includes a pair of electrodes electrically connected to respective underlying electrical connection pads, and wherein the LED is thermally coupled to the metal base by one or more thermal vias, and thermally coupled through the metal base to the thermal connection pad.

A packaged LED for high temperature operation comprising:

• a metal base, the metal base including an underlying thermal connection pad and a pair of underlying electrical connection pads;
• a layer of electrically insulating material overlying the metal base;
• and
• an LED having a pair of electrodes overlying the metal base, wherein the LED is thermally coupled through the metal base to the thermal connection pad and at least one electrode is electrically connected to at least one of the underlying electrical connection pads by an electrical path including an insulated conducting via through the metal base.