Heat treatment apparatus and method of semiconductor wafer

A semiconductor wafer heat treatment method of heating a semiconductor wafer, comprising the steps of:

• placing a semiconductor wafer equivalent on a heating plate, and measuring temperatures when heating said semiconductor wafer equivalent, at portions preliminarily divided into a plurality of regions;
• and
• placing a semiconductor wafer on said heating plate, and heating said semiconductor wafer while controlling the temperature when heating said semiconductor wafer, for each of said plurality of regions, in accordance with a measured result of said temperatures,
• wherein heating occurs during a temperature-rising time period having a plurality of time period increments for each one of the plurality of regions, each one of the plurality of time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular time period increment is maintained.

A semiconductor wafer heat treatment method of heating a semiconductor wafer and then cooling it, including the steps of:

• placing a semiconductor wafer equivalent heated to a predetermined temperature on a cooling plate, and measuring temperatures when cooling said semiconductor wafer equivalent, at portions divided into a plurality of regions;
• placing a semiconductor wafer on a heating plate, and heating said semiconductor wafer to said predetermined temperature;
• and
• placing the semiconductor wafer heated to said predetermined temperature on said cooling plate, and cooling said semiconductor wafer while controlling, for each of said plurality of regions, the temperature when cooling said semiconductor wafer, in accordance with a measured result of said temperatures,
• wherein heating occurs during a temperature-rising time period having a plurality of temperature-rising time period increments for each one of the plurality of regions, each one of the plurality of temperature-rising time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular temperature-rising time period increment is maintained and
• wherein cooling occurs during a temperature-lowering time period having a plurality of temperature-lowering time period increments for each one of the plurality of regions, each one of the plurality of temperature-lowering time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular temperature-lowering time period increment is maintained.

A semiconductor wafer heat treatment method of heating a semiconductor wafer and then cooling it, including the steps of:

• placing a semiconductor wafer on a heating plate, and heating said semiconductor wafer to a predetermined temperature;
• and
• placing said semiconductor wafer heated to said predetermined temperature on a cooling plate, and measuring temperatures when cooling said semiconductor wafer, at portions divided into a plurality of regions, and then cooling said semiconductor wafer while controlling, for each of said plurality of regions, the temperature when cooling said semiconductor wafer, in accordance with a measured result of said temperature,
• wherein heating occurs during a temperature-rising time period having a plurality of temperature-rising time period increments for each one of the plurality of regions, each one of the plurality of temperature-rising time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular temperature-rising time period increment is maintained and
• wherein cooling occurs during a temperature-lowering time period having a plurality of temperature-lowering time period increments for each one of the plurality of regions, each one of the plurality of temperature-lowering time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular temperature-lowering time period increment is maintained.

A semiconductor wafer heat treatment method of heating a semiconductor wafer and then cooling it, including the steps of:

• placing a semiconductor wafer on a heating plate, and heating said semiconductor wafer while performing a temperature control on each region;
• and
• placing said heated semiconductor wafer on a cooling plate, and cooling said semiconductor wafer while performing a temperature control on each region
• wherein heating occurs during a temperature-rising time period having a plurality of temperature-rising time period increments for each one of the plurality of regions, each one of the plurality of temperature-rising time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular temperature-rising time period increment is maintained and
• wherein cooling occurs during a temperature-lowering time period having a plurality of temperature-lowering time period increments for each one of the plurality of regions, each one of the plurality of temperature-lowering time period increments being associated with a range of temperature tolerances within which the temperature associated with a particular temperature-lowering time period increment is maintained.