Packaging integrated circuits with adhesive posts
AssigneeInternational Business Machines Corporation
InventorsBarry A. Bonitz, Eric A. Johnson, Michael B. Vincent
Life of this patent
Estimating the term…
Abstract
A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.
Claims15
A package comprising:
- a substrate;
- an integrated circuit (IC) attached to said substrate by a set of conductive pads;
- and
- a heat spreader attached to said IC by a thermally conductive material and attached to said substrate by a set of posts of rigid adhesive,
- wherein the package does not comprise a stiffener bonded to the substrate.
A package for an integrated circuit, comprising:
- a substrate;
- an integrated circuit (IC) attached to said substrate by a set of conductive pads;
- and
- a heat spreader attached to said IC by a thermally conductive material and attached to said substrate by a set of posts of rigid adhesive, wherein said set of posts are located in four corners of said package and at the centers of sides of said IC.
A method of packaging an IC comprising the steps of:
- providing a substrate;
- connecting electrical contacts on said IC to corresponding contacts on said substrate;
- providing a substantially planar heat spreader;
- thermally connecting said heat spreader to a side of said IC opposite said electrical contacts with a thermally conductive material;
- and
- attaching said heat spreader to said substrate with a set of adhesive posts,
- wherein the method does not comprise bonding a stiffener to the substrate.
Dependencies are inferred from the claim text.