Back to results
US 7,094,844 B2Granted
Liquid epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKazuaki Sumita, Shingo Ando, Toshio Shiobara
Life of this patent
Estimating the term…
Abstract
A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.
Claims6
A liquid epoxy resin composition comprising
- (A) a liquid epoxy resin,
- (B) an aromatic amine curing agent selected from the group consisting of compounds of Formula (1) and Formula (2)
- wherein “n” is an integer of 1 to 5 and “R” is hydrogen, halogen, C1-8-alkyl, C1-8-alkenyl, C1-8-alkynyl, trifluoromethyl, or phenyl and the substituent groups on each aromatic ring may be the same or different
- (C) an inorganic filler.
1 more element
Dependencies are inferred from the claim text.