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US 7,094,822 B2Granted
Thermally conductive elastomeric pad
AssigneeCool Shield, Inc.
InventorsE. Mikhail Sagal, Kevin A. McCullough, James D. Miller
Life of this patent
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Abstract
The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
Claims5
A thermally conductive, elastomeric interface pad comprising:
- about 30 to about 60% by volume of an elastomer polymer matrix;
- and about 25 to about 60% by volume of a first thermally conductive filler material having an aspect ratio of at least 10:1;
- and
- about 10 to about 15% by volume of a second thermally conductive filler material having an aspect ratio of 5:1 or less.
1 more element
Dependencies are inferred from the claim text.