Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization

A method for conditioning a polishing pad used for polishing a micro-device workpiece, comprising:

• analyzing surface texture in a first region of the polishing pad;
• analyzing surface texture in a second region of the polishing pad;
• controlling at least one of a rotational velocity of the polishing pad, an existing downforce on the polishing pad, and a sweep velocity of an end effector in response to the analyzed surface texture of the first region to provide a desired first surface texture in the first region;
• and
• controlling at least one of the rotational velocity of the polishing pad, the existing downforce on the polishing pad, and the sweep velocity of the end effector in response to the analyzed surface texture of the second region to provide a desired second surface texture in the second region.

A method for conditioning a polishing pad used for polishing a micro-device workpiece, comprising:

• engaging an end effector with the polishing pad and moving at least one of the end effector and the polishing pad relative to the other;
• monitoring surface condition in a first region of the polishing pad;
• and
• providing a desired texture in the first region of the polishing pad by regulating at least one of a relative velocity between the polishing pad and the end effector, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the monitored surface condition of the first region.

A method for conditioning a polishing pad used for polishing a micro-device workpiece, comprising:

• engaging an end effector with the polishing pad and moving at least one of the end effector and the polishing pad relative to the other;
• determining roughness of surface texture in a first region of the polishing pad;
• and
• providing a desired texture in the first region of the polishing pad by adjusting at least one of a rotational velocity of the polishing pad, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the determined roughness of surface texture.