Method of forming a penetration electrode and substrate having a penetration electrode

A method of forming a penetration electrode, comprising:

• providing an electroconductive film on a first surface of a substrate, said substrate including a first insulating layer disposed on the first surface and a second insulating layer disposed on a second surface opposite the first surface, in at least a portion of the substrate where the penetration electrode is being formed;
• forming a micropore to penetrate through said substrate from the second surface of said substrate to the electroconductive film on the first surface of the substrate;
• forming an insulating layer on inside walls of said micropore;
• bonding a protecting member to the electroconductive layer on the first surface of said substrate;
• inserting an electroconductive substance into said micropore, said electroconductive substance and said electroconductive film providing a conductive path through said substrate;
• and
• removing said protective member from the electroconductive film on the first surface of said substrate in an area corresponding to the micropore;
• wherein said electroconductive film blocks off a first aperture of said micropore at said first surface of the substrate, and
• wherein said electroconductive substance is inserted into said micropore via an aperture of said micropore at said second surface of said substrate.