US 7,094,676 B1 · Semiconductor chip assembly with embedded metal pillar

Abstract

A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically attaching a semiconductor chip to the routing line and the pillar wherein the chip includes a conductive pad, the routing line extends laterally from the pillar towards the chip and the chip and the pillar extend vertically beyond the routing line in the same direction, forming an encapsulant wherein the chip and the pillar are embedded in the encapsulant, and forming a connection joint that electrically connects the routing line and the pad.

Claims300

Dependent claims

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

8 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, thereby etching through the metal base and reducing contact area between the metal base and the routing line, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

8 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip, the routing line and the pillar and extends vertically beyond the chip, the routing line and the pillar in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing a portion of the encapsulant, thereby exposing the first surface of the pillar such that the chip and the pillar remain embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

9 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base, wherein the insulative base contacts and is sandwiched between the metal base and the support, and between the routing line and the support;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip overlaps the insulative base and the support and extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support after forming the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

10 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
forming an insulative base that contacts the metal base and the routing line;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar using an insulative adhesive that contacts and is sandwiched between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the adhesive extends vertically beyond the chip in the second direction, and the insulative base extends vertically beyond the adhesive in the second direction;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
then
forming a through-hole that extends through the insulative base and the adhesive and exposes the pad;
and then
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

12 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and then
forming a connection joint that contacts and electrically connects the routing line and the pad and a first terminal that contacts the first surface of the pillar, extends vertically beyond the pillar in the first direction and is spaced from the connection joint during a plating operation, wherein a conductive trace that includes the routing line, the pillar and the first terminal is electrically connected to the pad and extends through the first surface of the encapsulant.

9 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base;
forming a routing line on the metal base;
etching the metal base, wherein an unetched portion of the metal base forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar using an adhesive that extends between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the first surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip and extends within and outside the periphery of the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support;
forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
and
forming a connection joint that electrically connects the routing line and the pad in the through-hole, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

7 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the first surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip and extends within and outside a periphery of the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, the support extends vertically beyond the insulative base in the second direction, and a connection joint electrically connects the routing line and the pad;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
removing the support, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar using an adhesive that extends between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the first surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support;
forming a first through-hole that extends through the insulative base and exposes the routing line without exposing the pad and a second through-hole that extends through the insulative base and the adhesive and exposes the pad without exposing the routing line;
and
forming a wire bond connection joint that electrically connects the routing line and the pad, wherein the connection joint is electrically connected to the routing line in the first through-hole and the pad in the second through-hole, the connection joint extends vertically beyond the insulative base in the second direction, and a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

7 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar using an adhesive that extends between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surfaces of the chip and the pillar face in a first direction, the second surfaces of the chip and the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the second surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming a wire bond connection joint that electrically connects the routing line and the pad;
forming an encapsulant that covers the chip and the connection joint and extends vertically beyond the chip, the routing line and the connection joint in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
removing the support, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

6 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, thereby etching through the metal base and reducing contact area between the metal base and the routing line, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip, the routing line and the pillar and extends vertically beyond the chip, the routing line and the pillar in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing a portion of the encapsulant, thereby exposing the first surface of the pillar such that the chip and the pillar remain embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

6 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base, wherein the insulative base contacts and is sandwiched between the metal base and the support, and between the routing line and the support;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip overlaps the insulative base and the support and extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support after forming the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

8 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
forming an insulative base that contacts the metal base and the routing line;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar using an insulative adhesive that contacts and is sandwiched between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the adhesive extends vertically beyond the chip in the second direction, and the insulative base extends vertically beyond the adhesive in the second direction;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
then
forming a through-hole that extends through the insulative base and the adhesive and exposes the pad;
and then
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

10 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and then
forming a connection joint that contacts and electrically connects the routing line and the pad and a first terminal that contacts the first surface of the pillar, extends vertically beyond the pillar in the first direction and is spaced from the connection joint during a plating operation, wherein a conductive trace that includes the routing line, the pillar and the first terminal is electrically connected to the pad and extends through the first surface of the encapsulant.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/719,823Filed 21 Nov 2003 · continuation

Priority

13 Oct 2000

Granted

22 Aug 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification29 codes

H10W 70/614
For connecting multiple chips together: the multiple chips being integrally enclosed
H10W 70/099
Package substrates; Interposers; Redistribution layers [RDL]: connecting interconnections to insulating or insulated package substrates,…
H10W 74/117
By a substrate and the encapsulations: the substrate having spherical bumps for external connection
H10W 70/60
Package substrates; Interposers; Redistribution layers [RDL]: insulating or insulated package substrates; Interposers; Redistribution layers

Family

Application09/687,619Parent of this continuation-in-part · filed 13 Oct 2000

Application09/878,626Parent of this continuation-in-part · filed 11 Jun 2001

Application09/939,140Parent of this division · filed 24 Aug 2001

Application10/235,331Parent of this continuation-in-part · filed 5 Sep 2002

Application60/507,145Us provisional application · filed 30 Sep 2003

Application60/509,299Us provisional application · filed 7 Oct 2003

Application10/714,794Parent of this continuation · filed 17 Nov 2003

US 6,653,742 B1Parent of this continuation-in-part

Application10/714,794Parent of this continuation-in-part

US 6,576,539 B1Parent of this division

Application10/235,331Parent of this division

US 6,653,217 B1Parent of this continuation-in-part

Application09/939,140Parent of this continuation-in-part

US 6,440,835 B1Parent of this continuation-in-part

US 7,190,080 B1Related patent

US 7,094,676 B1This patent

From the US filing history. Foreign family members aren’t listed.

Abstract

Claims300

Dependent claims

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

8 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, thereby etching through the metal base and reducing contact area between the metal base and the routing line, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

8 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip, the routing line and the pillar and extends vertically beyond the chip, the routing line and the pillar in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing a portion of the encapsulant, thereby exposing the first surface of the pillar such that the chip and the pillar remain embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

9 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base, wherein the insulative base contacts and is sandwiched between the metal base and the support, and between the routing line and the support;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip overlaps the insulative base and the support and extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support after forming the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

10 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
forming an insulative base that contacts the metal base and the routing line;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar using an insulative adhesive that contacts and is sandwiched between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the adhesive extends vertically beyond the chip in the second direction, and the insulative base extends vertically beyond the adhesive in the second direction;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
then
forming a through-hole that extends through the insulative base and the adhesive and exposes the pad;
and then
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

12 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base with first and second opposing surfaces;
then
forming an etch mask on the first surface of the metal base;
forming a routing line on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and then
forming a connection joint that contacts and electrically connects the routing line and the pad and a first terminal that contacts the first surface of the pillar, extends vertically beyond the pillar in the first direction and is spaced from the connection joint during a plating operation, wherein a conductive trace that includes the routing line, the pillar and the first terminal is electrically connected to the pad and extends through the first surface of the encapsulant.

9 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base;
forming a routing line on the metal base;
etching the metal base, wherein an unetched portion of the metal base forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar using an adhesive that extends between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the first surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip and extends within and outside the periphery of the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support;
forming a through-hole that extends through the insulative base and the adhesive and exposes the routing line and the pad;
and
forming a connection joint that electrically connects the routing line and the pad in the through-hole, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

7 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the first surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip and extends within and outside a periphery of the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, the support extends vertically beyond the insulative base in the second direction, and a connection joint electrically connects the routing line and the pad;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
removing the support, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar using an adhesive that extends between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the first surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support;
forming a first through-hole that extends through the insulative base and exposes the routing line without exposing the pad and a second through-hole that extends through the insulative base and the adhesive and exposes the pad without exposing the routing line;
and
forming a wire bond connection joint that electrically connects the routing line and the pad, wherein the connection joint is electrically connected to the routing line in the first through-hole and the pad in the second through-hole, the connection joint extends vertically beyond the insulative base in the second direction, and a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

7 more elements

A method of making a semiconductor chip assembly, comprising the following steps in the sequence set forth:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the;
etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base that extends between the metal base and the support, and between the routing line and the support;
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
mechanically attaching a semiconductor chip to the routing line and the pillar using an adhesive that extends between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surfaces of the chip and the pillar face in a first direction, the second surfaces of the chip and the pillar face in a second direction opposite the first direction, the chip, the routing line and the pillar overlap the insulative base and the support, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line and the second surface of the chip in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming a wire bond connection joint that electrically connects the routing line and the pad;
forming an encapsulant that covers the chip and the connection joint and extends vertically beyond the chip, the routing line and the connection joint in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
removing the support, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

6 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, thereby etching through the metal base and reducing contact area between the metal base and the routing line, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

5 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
forming an encapsulant that covers the chip, the routing line and the pillar and extends vertically beyond the chip, the routing line and the pillar in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing a portion of the encapsulant, thereby exposing the first surface of the pillar such that the chip and the pillar remain embedded in the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

6 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
mechanically attaching the metal base, the etch mask and the routing line to a support using an insulative base, wherein the insulative base contacts and is sandwiched between the metal base and the support, and between the routing line and the support;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip overlaps the insulative base and the support and extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the insulative base extends vertically beyond the chip, the routing line and the pillar in the second direction, and the support extends vertically beyond the insulative base in the second direction;
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
removing the support after forming the encapsulant;
and
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

8 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
forming an insulative base that contacts the metal base and the routing line;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar using an insulative adhesive that contacts and is sandwiched between the chip and the insulative base, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar and the second surface of the chip face in a first direction, the first surface of the chip and the second surface of the pillar face in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, the routing line extends laterally from the pillar towards the chip, the adhesive extends vertically beyond the chip in the second direction, and the insulative base extends vertically beyond the adhesive in the second direction;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
then
forming a through-hole that extends through the insulative base and the adhesive and exposes the pad;
and then
forming a connection joint that electrically connects the routing line and the pad, wherein a conductive trace that includes the routing line and the pillar is electrically connected to the pad and extends through the first surface of the encapsulant.

10 more elements

A method of making a semiconductor chip assembly, comprising:

providing a metal base, an etch mask and a routing line, wherein the metal base includes first and second opposing surfaces, the etch mask is formed on the first surface of the metal base and the routing line is formed on the second surface of the metal base;
then
etching the metal base, wherein an unetched portion of the metal base defined by the etch mask forms a pillar that includes first and second opposing surfaces, the first surface of the pillar faces away from the routing line and contacts the etch mask, and the second surface of the pillar contacts the routing line;
then
mechanically attaching a semiconductor chip to the routing line and the pillar, wherein the chip includes first and second opposing surfaces, the first surface of the chip includes a conductive pad, the first surface of the pillar faces in a first direction, the second surface of the pillar faces in a second direction opposite the first direction, the chip extends vertically beyond the routing line in the first direction, the pillar is disposed outside a periphery of the chip and extends vertically beyond the routing line in the first direction, and the routing line extends laterally from the pillar towards the chip;
then
forming an encapsulant that covers the chip and extends vertically beyond the chip and the routing line in the first direction, wherein the encapsulant includes a first surface that faces in the first direction and a second surface that faces in the second direction, and the chip and the pillar are embedded in the encapsulant;
and then
forming a connection joint that contacts and electrically connects the routing line and the pad and a first terminal that contacts the first surface of the pillar, extends vertically beyond the pillar in the first direction and is spaced from the connection joint during a plating operation, wherein a conductive trace that includes the routing line, the pillar and the first terminal is electrically connected to the pad and extends through the first surface of the encapsulant.

6 more elements

Dependencies are inferred from the claim text.

Semiconductor chip assembly with embedded metal pillar

Life of this patent

Abstract

Claims300

Semiconductor chip assembly with embedded metal pillar

Life of this patent

Abstract

Claims300