Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices

A method for assembling semiconductor devices in a stacked arrangement, comprising:

• providing a first semiconductor device with at least one bond pad positioned substantially centrally on a surface thereof;
• and
• positioning a first rerouting element over the surface of the first semiconductor device with a contact of the first rerouting element communicating with the at least one bond pad, a circuit trace of the first rerouting element extending laterally toward a peripheral edge of the first semiconductor device and establishing communication between the at least one bond pad and at least one first rerouted bond pad located proximate the first peripheral edge;
• positioning a second semiconductor device having at least one bond pad positioned substantially centrally on a surface thereof over the first rerouting element with the first rerouted bond pad location being located adjacent to and exposed laterally beyond a peripheral edge of the second semiconductor device;
• and
• positioning a second rerouting element over the surface of the second semiconductor device with a contact of the second rerouting element communicating with the at least one bond pad, a circuit trace of the second rerouting element extending laterally toward another peripheral edge of the second semiconductor device, located opposite the peripheral edge positioned adjacent to the first rerouted bond pad location, and establishing communication between the at least one bond pad and at least one second rerouted bond pad located proximate the another peripheral edge of the second semiconductor device.