Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
Claims9
A method of manufacturing a substrate, comprising:
- providing a substrate;
- forming a penetrating hole in the substrate so that an internal wall of the penetrating hole of the substrate has a protrusion;
- and
- forming a wiring pattern above the substrate, the wiring pattern formed over the penetrating hole.
Dependencies are inferred from the claim text.