Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices

A method for disposing underfill material on a microelectronic device having a plurality of electrical couplers, the method comprising:

• depositing an underfill layer onto the microelectronic device and covering at least a portion of the electrical couplers, the underfill layer comprising a binder and a plurality of electrically charged filler elements in the binder;
• and
• applying an electric field to the underfill layer to manipulate at least a portion of the electrically charged filler elements after depositing the underfill layer.

A method for disposing underfill material on a microelectronic device having a plurality of electrical couplers, the method comprising:

• covering at least a portion of the electrical couplers of the microelectronic device with an underfill layer including a matrix and a plurality of electrically charged filler elements;
• and
• moving at least a portion of the electrically charged filler elements within the underfill layer by applying an electric field to the underfill layer.

A method of underfilling a microelectronic device assembly including a microelectronic component, a substrate, and a plurality of electrical couplers coupling the microelectronic component to the substrate, the method comprising:

• disposing an underfill layer including a plurality of electrically charged filler elements between the microelectronic component and the substrate;
• and
• moving at least a portion of the plurality of electrically charged filler elements within the underfill layer by applying an electric field to the underfill layer.

A method of underfilling a microelectronic device assembly, the method comprising:

• disposing an underfill layer including a plurality of electrically charged filler elements between a microelectronic component and a substrate coupled to the microelectronic component by electrical couplers;
• and
• applying an electric field to the underfill layer to manipulate at least a portion of the electrically charged filler elements within the underfill layer.

A method of underfilling a microelectronic device assembly including a microelectronic component, a substrate, and electrical couplers coupling the microelectronic component to the substrate, the method comprising disposing an underfill layer including a plurality of electrically charged filler elements between the microelectronic component and the substrate so that the filler elements are distributed generally uniformly throughout the underfill layer.

A method of underfilling a microelectronic device assembly including a microelectronic component, a substrate, and electrical couplers coupling the microelectronic component to the substrate, the method comprising:

• disposing an underfill layer including a plurality of electrically charged filler elements between the microelectronic component and the substrate, wherein the underfill layer has a zone having a coefficient of thermal expansion;
• and
• changing the coefficient of thermal expansion of the zone by applying an electric field to the underfill layer to manipulate at least a portion of the electrically charged filler elements.