Method for encapsulating an electrical component
AssigneeEpcos AG
InventorsAlois Stelzl, Hans Krüger, Gregor Feiertag
Life of this patent
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Abstract
An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.
Claims21
A method for encapsulating an electrical component that includes a chip comprising component structures on its front side, comprising:
- mounting the component on a surface of a carrier in flip chip technique;
- connecting the component with electrical terminal surfaces that are present on the surface of the carrier, so that the front side of the chip is oriented towards the carrier and is situated at a distance therefrom;
- laminating a film onto an entire surface of the carrier, this surface being provided with the chip mounted thereon;
- and
- applying and hardening a plastic or resinous compound in liquid form so as to surround the component on the carrier;
- and
- before the application of the plastic compound:
- removing the film in the laminated area on the carrier, in an area of a first strip around the chip.
A method for encapsulating an electrical component that includes a chip comprising component structures on its front side, comprising:
- mounting the component on a surface of a carrier in flip chip technique;
- connecting the component with electrical terminal surfaces that are present on the surface of the carrier, so that the front side of the chip is oriented toward the carrier and is situated at a distance therefrom;
- laminating a film onto an entire surface of the carrier, this surface being provided with the chip mounted thereon;
- and
- applying and hardening a plastic or resinous compound in liquid from so as to surround the component on the carrier;
- removing the film on lateral surfaces of the chip in a second strip that follows a full periphery of the chip before the application of the plastic compound;
- and
- applying the plastic compound in such a way that it lies peripherally around the chip in the region of the second strip, and seals tightly with the chip.
A method for encapsulating an electrical component that includes a chip comprising component structures on its front side, comprising:
- mounting the component on a surface of a carrier in flip chip technique;
- connecting the component with electrical terminal surfaces that are present on the surface of the carrier, so that the front side of the chip is oriented towards the carrier and is situated at a distance therefrom;
- laminating a film onto an entire surface of the carrier, this surface being provided with the chip mounted thereon;
- and
- applying and hardening a plastic or resinous compound in liquid form so as to surround the component on the carrier;
- utilizing a film that can be hardened by the action of a laser;
- hardening, after lamination, the film using a laser in an area whose inner edge lies tightly against the chip in peripheral fashion, and whose outer edge lies tightly on the carrier;
- and
- removing, before the application of the plastic compound, the non-hardened areas of the film in a plasma process.
A method for encapsulating an electrical component that includes a chip comprising component structures on its front side, comprising:
- mounting the component on a surface of a carrier in flip chip technique;
- connecting the component with electrical terminal surfaces that are present on the surface of the carrier, so that the front side of the chip is oriented toward the carrier and is situated at a distance therefrom;
- laminating a film onto an entire surface of the carrier, this surface being provided with the chip mounted thereon;
- and
- applying and hardening a plastic or resinous compound in liquid from so as to surround the component on the carrier;
- metalizing an overall surface of the carrier of the resultant produced construction after the sawing of the hardened plastic compound;
- wherein the metalizing comprises:
- producing first a base metallization by sputtering;
- and
- subsequently reinforcing the metallization in a second process differing therefrom.
Dependencies are inferred from the claim text.